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To minimize potential differences between conductive objects, bonding is the most effective method. Bonding involves creating a low-resistance path between two or more conductive materials, allowing for the equalization of electrical potential. This process is crucial in preventing electrical shocks, equipment damage, and ensuring safety in environments where conductive materials are present.

By connecting conductive objects together through bonding, any difference in electrical potential can be diminished, reducing the risk of sparking or electrical discharge. This is particularly important in industrial settings, around sensitive electronic equipment, or in locations where flammable materials are present.

Grounding, while also essential for electrical safety, is primarily focused on providing a path for electric current to safely dissipate into the earth rather than specifically targeting the equalization of potentials between conductive objects. Insulation serves to protect against electrical currents and does not directly address potential differences. Shielding is used to protect sensitive equipment from external electromagnetic fields but does not equalize potential differences between objects. Thus, bonding is clearly the method specifically designed to minimize potential differences effectively.